High precision kovar alloy 4j29 machining parts
Material:
4 j29 / W.N r. 1.3912 / AISI / ASTM F15 / JIS EMAS – 1001
Dimensions: 7-188mm
Material thickness: 0.8-4.0mm
Process: Stamping and machining
Product technical requirements:
After processing, the parts need to be purified by hydrogen furnace, so that the sealed glass surface has no bubbles to remove impurities such as carbon.
Application: Kovar Alloys for glass sealing
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Product Description:
Key Features:
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Material Excellence: Manufactured from Kovar Alloy 4J29, ensuring matched thermal expansion with borosilicate glass and ceramics for leak-free, long-term sealing integrity.
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Precision Engineering: Custom-designed using advanced CNC machining and forming techniques to meet exact dimensional tolerances (up to ±0.01mm) for complex geometries.
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Vacuum-Optimized: Ideal for ultra-high vacuum (UHV) systems, electron devices, and hermetic enclosures, with surface finishes and treatments to minimize outgassing.
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Robust Performance: Resistant to thermal cycling, corrosion, and mechanical stress, maintaining functionality in temperatures ranging from -200°C to +450°C.
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Custom Solutions: Tailored to application-specific requirements, including size, shape, joint configurations, and metallization layers for brazing or welding.
Applications:
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Semiconductor and MEMS packaging
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Aerospace sensors and vacuum feedthroughs
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Medical implantable device encapsulation
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Laser/optical systems and RF/microwave components
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High-reliability power electronics and cryogenic equipment
Why Choose Us?
Leverage our expertise in vacuum-grade metallurgy and decades of experience in precision sealing solutions. We provide full technical support, from prototyping to volume production, ensuring seamless integration into your critical systems.
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FAQ
You can tell us your needs (such as specifications, quantities, materials, drawings, etc.) by email(info@prekovar.com), phone or by submitting the form on our website.
With over 10 years of specialized focus on Kovar/alloy processing, we master the unique challenges of this low-expansion material. Our advanced stamping techniques ensure micron-level accuracy, ideal for critical applications in electronics, aerospace, and hermetic sealing components.
